TSMC has bragged about higher power efficiency, which is connected with more speed, as it formally begins mass manufacturing of 3nm CPUs, which are anticipated in the iPhone 15 and new Macs.
As anticipated, TSMC celebrated the beginning of manufacturing with a ceremony on Thursday. Bloomberg believes that executives used the occasion to make predictions regarding the impact of 3nm chips on upcoming gadgets.
Mark Liu, the company's chair, also discussed plans for the subsequent generation using a 2nm manufacturing technique. In a speech, Liu made reference to 2nm CPUs while also stating that TSMC is optimistic about the future and will continue to operate in Taiwan despite constructing plants elsewhere. Taiwan will undoubtedly play an even more crucial role in the global economy, he predicted, as the semiconductor industry would expand quickly during the coming ten years.
The benefit of 3nm processors over the present 4nm and 5nm ones is that they are able to deliver better performance while unquestionably consuming less power. According to Lui, TSMC's new 3nm processors are 35% more power efficient and have an undefined increase in speed.
The A-series CPUs from Apple have historically increased in speed by 10% to 25% with each subsequent iteration. Given all the external elements that affect it, the increase in power efficiency is more difficult to assess. Although he did not reveal who is buying them, Lui claims that the demand for 3nm processors is "extremely robust." The largest customer of TSMC, which will generate around 26% of the processor company's sales in 2021, is Apple.
As a result, it is anticipated that Apple will be a key market for 3nm CPUs. Separately, it was previously projected that a 2022 M2 MacBook Pro will feature TSMC's 3nm chips, but it has since been revealed that Apple will be the first to use them.
From January 2 through January 8, 2023, AppleInsider will be in attendance at the Consumer Electronics Show, where we hope to see products like 8K monitors, HomeKit, Wi-Fi 6e devices, and more.
